- Manufacturer:
-
- CUI Devices (1)
- Length:
-
- Material:
-
- Material Finish:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 288X188X16.5MM |
242
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 43.1 X 43.1 X 16 |
994
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X188X16.5MM |
12
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | 1.40" WIDE X 12" BGA HEATSINK EX |
71
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | 1.75WX36" EXTRUS 16249 XX8260-65 |
47
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | 1.40" WIDE X 36" BGA HEATSINK EX |
13
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | 1.75WX12" EXTRUS 16249 XX8260-65 |
9,991
In-stock
|
View details Get Quote |









