- Manufacturer：
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- CUI Devices (2)
- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 25 MM |
446
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 18 MM |
956
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK FOR BGAS FIN HGT .45" |
9,117
In-stock
|
View details Get Quote |
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