- Manufacturer:
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- CUI Devices (3)
- Length:
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- Material:
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- Material Finish:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X35X25MM |
393
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 25 MM |
446
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 40 X 40 X 25 MM |
735
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X70X25MM |
10
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 25 MM |
886
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X25X25MM |
6
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X35X25MM |
14
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X70X25MM |
25
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X25X25MM |
4
In-stock
|
View details Get Quote |









