- Manufacturer：
-
- CUI Devices (1)
- Material：
-
- Material Finish：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X6X8MM |
127
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.5 X 33.5 X 8 |
937
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X37X8MM |
10
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X37X8MM |
6,274
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X6X8MM |
9,628
In-stock
|
View details Get Quote |
Copyright © GUANGHONGFA (HK)TECHNOLOGY CO., LIMITED All Rights Reserved. 
